Israeli Patent 260607

Israeli Patent 260607: Electromagnetic Shielding Enclosure from Composite Materials

Israeli Patent 260607 covers an enclosure that shields its contents from electromagnetic waves using conductive panels joined by overlapping L-shaped seams, secured with a non-conductive adhesive. Filed in July 2018 and granted in September 2022 by the Israel Patent Office, it addresses a specific weak point in shielding design: the gap between panels, where most electromagnetic leakage actually happens.

In this guide:

What Patent 260607 Actually Covers

Patent 260607, officially titled "Enclosure for protecting its contents from electromagnetic waves," was filed with the Israel Patent Office on July 15, 2018. It was published on June 1, 2022, and granted on September 2, 2022. The patent is held by inventors Dekel Keisar and Asa Avraham Levental.

The core claim describes a housing assembled from conductive panels, joined so that L-shaped contact surfaces form at every seam. Those overlapping L-shaped surfaces create a continuous conductive path around the entire enclosure, which is what actually blocks EMI/RFI. A non-conductive adhesive secures the panels at each seam, and the patent specifically allows that adhesive to be waterproof, so a single joint can handle both electromagnetic shielding and moisture protection.

How the L-Shaped Seam Blocks Electromagnetic Leakage

Most shielding failures happen at the joints, not in the middle of a flat panel. A straight, flat seam between two panels leaves a narrow gap that electromagnetic waves can exploit. Patent 260607 solves this by shaping the panel edges with grooves or an integral L-shaped extension, so that wherever two panels meet, they form an overlapping L-shaped contact surface instead of a simple butt joint.

That overlap increases the effective contact area between panels and closes the kind of microscopic gap that a flat seam cannot avoid. The patent also allows for additional conductive bonding elements at the seam, such as a rim or frame with an L-shaped cross-section, which reinforces the conductive continuity while the adhesive keeps the joint sealed.

Why a Non-Conductive Adhesive Matters

The panels are not welded or bolted at the seam. They are bonded with an adhesive that does not conduct electricity, applied directly at the L-shaped contact surfaces. This detail matters for two reasons. First, it keeps the panels electrically isolated from each other except at the deliberate conductive contact points, which protects the shielding geometry. Second, the patent allows the adhesive itself to be waterproof, so the same joint handles sealing against moisture without a separate gasket layer.

For a lid or removable cover, the patent specifies an adhesive with a lower melting temperature than the adhesive used on the rest of the enclosure. That lets a technician open the lid for maintenance without disturbing the permanent seams that hold the rest of the housing together.

Sizing the Seam to the Wavelength You Need to Block

One detail engineers often miss: the dimensions of the L-shaped contact surface are not arbitrary. According to the patent, they are selected based on the wavelength of the electromagnetic waves the enclosure needs to block. A longer wavelength tolerates a larger seam geometry, while a shorter wavelength requires tighter, more frequent contact points along the joint.

That means enclosure design should start with the target frequency range, not with a generic panel thickness. Once the frequency range is defined, the seam geometry, contact density, and panel dimensions follow from it, rather than relying on a one-size-fits-all metal shell.

How This Type of Enclosure Gets Assembled

The patent also describes a manufacturing method, not just the final structure. The process follows a consistent sequence:

Panel preparation: conductive panels are manufactured with grooves or an integral L-shaped extension at the edges, so they form matching L-shaped contact surfaces when joined.

Adhesive placement: the non-conductive adhesive is applied precisely at the contact surfaces before final assembly.

Preliminary assembly: auxiliary bolts, fasteners, or a temporary frame hold the panels in position while the fit is verified.

Final bonding: the panels are secured permanently, closing the overlapping L-shaped seam along every joint.

Lid attachment: a removable lid is bonded as an additional conductive element, typically with a lower-melting-temperature adhesive for future access.

Why Composite Manufacturers Should Pay Attention

Traditional EMI shielding relies on a solid metal shell, which is straightforward but heavy and prone to corrosion. The seam approach in Patent 260607 opens the door to lighter panel materials with a conductive coating or layer, as long as the L-shaped seam geometry preserves the continuous conductive path. That flexibility matters most in defense, aerospace, and medical device manufacturing, where every gram of added weight has a real performance cost.

Nanofiber applies this kind of shielding-and-seam thinking in its composite manufacturing work for the defense, aerospace, and medical device sectors, backed by an ISO 9001-certified production process. For manufacturers evaluating enclosure design, the wavelength-based seam sizing described in this patent is a useful reference point regardless of which vendor eventually builds the part.

FAQ

What does Israeli Patent 260607 actually protect?

It protects a method for building an enclosure that blocks electromagnetic waves. The method joins conductive panels with overlapping L-shaped seams, secured by a non-conductive adhesive that can also be waterproof.

Who owns Patent 260607?

The patent is held by inventors Dekel Keisar and Asa Avraham Levental. It was filed on July 15, 2018, and granted by the Israel Patent Office on September 2, 2022.

How is the seam size determined?

The dimensions of the L-shaped contact surface are chosen based on the wavelength of the electromagnetic radiation the enclosure needs to block. Longer wavelengths allow a larger seam, shorter wavelengths require tighter contact points.

Can this type of enclosure also be waterproof?

Yes. The patent specifies that the non-conductive adhesive used at the seams can be waterproof, giving the enclosure both electromagnetic shielding and moisture protection at the same joint.

Need a lightweight composite enclosure engineered for electromagnetic shielding? Nanofiber builds ISO 9001-certified composite solutions for defense, aerospace, and medical device applications. Contact our team to discuss your project.